(Click Category to List Courses)
19 - EEE - Electrical & Electronics Engineering
EEE 141 - High Speed PCB Design for EMC and Signal Integrity
| Code | Start Date | Duration | Venue | |
|---|---|---|---|---|
| EEE 141 | 28 October 2024 | 5 Days | Istanbul | Registration Form Link |
| EEE 141 | 02 December 2024 | 5 Days | Istanbul | Registration Form Link |
| EEE 141 | 27 January 2025 | 5 Days | Istanbul | Registration Form Link |
| EEE 141 | 24 March 2025 | 5 Days | Istanbul | Registration Form Link |
| EEE 141 | 19 May 2025 | 5 Days | Istanbul | Registration Form Link |
| EEE 141 | 14 July 2025 | 5 Days | Istanbul | Registration Form Link |
| EEE 141 | 08 September 2025 | 5 Days | Istanbul | Registration Form Link |
| EEE 141 | 03 November 2025 | 5 Days | Istanbul | Registration Form Link |
| EEE 141 | 29 December 2025 | 5 Days | Istanbul | Registration Form Link |
Course Description
The widespread growth of high-speed digital systems poses increasing challenges to the designers of modern electronics equipment. The use of high speed/high edge rate digital circuits, along with the need for low power consumption, have contributed to higher electromagnetic emissions from circuits, on the one hand, and increased sensitivity of the circuits on the other, leading to Electromagnetic Interference (EMI) problems. Moreover, as the wavelength of operation is getting smaller and smaller, the application of high frequency design techniques is becoming a must to preserve the integrity of digital signals. The use of combined signal integrity (SI) and electromagnetic compatibility (EMC) solutions is of fundamental importance for the design of reliable equipment having perfect functionality and compliance with EMI/EMC standards. This course stresses the fundamental concepts and tools that board designers must be familiar with to avoid electromagnetic compatibility and signal integrity problems. Participants completing the course will be able to make good decisions regarding component selection, component placement, and trace routing.
Course Objectives
- Understanding the noise generation and radiated emission mechanisms in PCBs
- Recognizing signal integrity problems in PCBs
- Applying proper design techniques to achieve signal integrity and EMC
- Analyzing and testing the PCBs from signal integrity and EMC point of views
Who Should Attend?
- Technicians
- Digital Circuit Designers
- System Engineers
- EMC Test Engineers
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- Signal Integrity Engineers
Course Details/Schedule
Day 1
- Introduction to high speed design from EMC and SI point of views
- Noise sources on PCBs
- Common mode and differential mode radiated emission mechanisms in PCBs
- Fundamental concepts: inductance, capacitance and non-ideal behavior of components
Day 2
- High-speed digital devices and I/O modeling
- PCB transmission lines
- Reflection on signal lines and impedance matching on the PCB
- Crosstalk on the PCB
Day 3
- Grounding concept
- Power distribution network design
- Differential signaling and discontinuity modeling in PCBs
- PCB routing topologies for high speed PCBs
Day 4
- PCB materials for high-speed design
- PCB layout and stack-up guidelines for EMI control
- Mixed signal PCB Layout
- Clock Circuits
Day 5
- I/O Connectors
- Shielding on PCBs
- SI measurement techniques in frequency and time domains
- Pre-compliance EMC measurement techniques
