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15 - EEE - Electrical & Electronics Engineering


EEE 141 - High Speed PCB Design for EMC and Signal Integrity

Code Start Date Duration Venue Fees
EEE 141 14 June 2021 5 Days Istanbul $ 3950 Registration Form Link
EEE 141 30 August 2021 5 Days Istanbul $ 3950 Registration Form Link
EEE 141 25 October 2021 5 Days Istanbul $ 3950 Registration Form Link
EEE 141 20 December 2021 5 Days Istanbul $ 3950 Registration Form Link
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Course Description

The widespread growth of high-speed digital systems poses increasing challenges to the designers of modern electronics equipment. The use of high speed/high edge rate digital circuits, along with the need for low power consumption, have contributed to higher electromagnetic emissions from circuits, on the one hand, and increased sensitivity of the circuits on the other, leading to Electromagnetic Interference (EMI) problems. Moreover, as the wavelength of operation is getting smaller and smaller, the application of high frequency design techniques is becoming a must to preserve the integrity of digital signals. The use of combined signal integrity (SI) and electromagnetic compatibility (EMC) solutions is of fundamental importance for the design of reliable equipment having perfect functionality and compliance with EMI/EMC standards. 

Course Objectives

  • Understanding the noise generation and radiated emission mechanisms in PCBs
  • Recognizing signal integrity problems in PCBs
  • Applying proper design techniques to achieve signal integrity and EMC
  • Analyzing and testing the PCBs from signal integrity and EMC point of views

Who Should Attend?

  • Digital circuit designers
  • System engineers
  • EMC test engineers

Course Details/Schedule

Day 1

  • Introduction to high speed design from EMC and SI point of views
  • Noise sources on PCBs
  • Common mode and differential mode radiated emission mechanisms in PCBs
  • Fundamental concepts: inductance, capacitance and non-ideal behavior of components

Day 2

  • High-speed digital devices and I/O modeling
  • PCB transmission lines
  • Reflection on signal lines and impedance matching on the PCB
  • Crosstalk on the PCB

Day 3

  • Grounding concept
  • Power distribution network design 
  • Differential signaling and discontinuity modeling in PCBs
  • PCB routing topologies for high speed PCBs

Day 4

  • PCB materials for high-speed design 
  • PCB layout and stack-up guidelines for EMI control
  • Mixed signal PCB Layout 
  • Clock Circuits

Day 5

  • I/O Connectors
  • Shielding on PCBs
  • SI measurement techniques in frequency and time domains
  • Pre-compliance EMC measurement techniques